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AX7900 Unicomp 90KV X-ray Inspection for IC Bond Wire and Internal Structure

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AX7900 Unicomp 90KV X-ray Inspection for IC Bond Wire and Internal Structure

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Supply Ability : 30 sets per month

Type : Electronic semiconductor

Model Number : AX7900

MOQ : 1Set

Delivery Time : 15 work days

Power consumption : 0.8KW

Payment Terms : L/C,T/T

Pixel Matrix : 1536*1536[pixel]

CPU Model : i7 6 generation

Price : can negotiate

Frame Rates : Max30fps

RAM : 16G

Certification : CE, FDA

Place of Origin : China

Packaging Details : Wooden Case, Waterproof, Anti-collision

Brand Name : UNICOMP

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AX7900 Unicomp 90KV X-ray Inspection System
The Unicomp AX7900 90KV X-ray inspection system is specifically engineered for cable terminal crimp quality assessment and comprehensive electronic component analysis, providing precise inspection capabilities for various industrial applications.
System Overview
The AX7900 features a 90kV/5μm micro-focus X-ray tube and high-performance FPD detector in a multifunctional workstation design. It includes standard XY multi-axis motion with optional ±60° tilt capability. Independent Z-axis movement of both X-ray tube and FPD enables flexible magnification and field of view adjustment. Integrated with target positioning system and professional DXI image software, it supports XY programming for automated batch inspection routines.
Key Applications
  • LED, SMT, BGA, CSP, Flip Chip Inspection
  • Semiconductor and Packaging Components
  • Battery Industry Analysis
  • Electronic Components and Auto Parts
  • Photovoltaic Industry Inspection
  • Aluminum Die Casting and Moulding Plastic
  • Ceramics and Other Special Industries
System Features
  • 90KV 5μm X-ray tube with FPD Detector
  • Multi-function workstation with X-Y multi-axis movement
  • ±60° "Arc" motion (Optional)
  • Motion controls include X/Y table motion plus Z-axis tube and detector movement
  • Multi-function DXI image processing system
  • X/Y programming function for multiple image inspection routines
  • Maximum loading area: 420mm x 420mm
  • Maximum detection area: 380mm x 380mm
  • System magnification up to 300X
  • BGA void/area auto-measurement with report generation
Technical Specifications
Category Parameter Specification
System Parameters Size 1215(L) x 1325(W) x 1700(H) mm
Weight 1240 kg
Power 220V±10% 50Hz/60Hz 4A
Power Consumption 0.8 kW
X-ray Tube Type Closed
Max. Voltage 90 kV
Max. Power 8 W
Spot Size 5 μm
X-ray System Intensifier FPD
Monitor 24" HD
Geometric Magnification 52X
Detection Region Max. Loading Size 600mm x 520mm
Max. Inspection Area 505mm x 440mm
X-ray Leakage <1 μSv/h
Inspection Images
AX7900 Unicomp 90KV X-ray Inspection for IC Bond Wire and Internal Structure
IC X-Ray machine AX7900 inspection sample showing detailed component analysis
Application Fields
AX7900 Unicomp 90KV X-ray Inspection for IC Bond Wire and Internal Structure
AX7900 X-ray system application fields and industries diagram
Dimensions and Appearance
AX7900 Unicomp 90KV X-ray Inspection for IC Bond Wire and Internal Structure
AX7900 X-ray system dimensions and physical appearance illustration

Product Tags:

AX7900 X-ray inspection machine

      

Unicomp IC bond wire X-ray

      

90KV X-ray for internal structure

      
Wholesale AX7900 Unicomp 90KV X-ray Inspection for IC Bond Wire and Internal Structure from china suppliers

AX7900 Unicomp 90KV X-ray Inspection for IC Bond Wire and Internal Structure Images

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